发明名称 |
METHOD OF COATING OR SEALING OF ELECTRONIC COMPONENTS OR COMPONENT GROUPS |
摘要 |
In a method of coating or sealing electronic components and component groups using single-component reactive resin mixtures which are storage-stable at room temperature for several months, reactive resin mixtures are used which contain the following components: � ���- a cationically curable solvent-free epoxy resin, ���- a triarylsulphonium salt with hexafluorophosphate, hexafluoroarsenate or hexafluoroantimonate as anion, in a proportion of 0.01 to 5% by weight (based on epoxy resin) and ���- a benzylthiolanium salt with hexafluorophosphate, hexafluoroarsenate or hexafluoroantimonate as anion, in a proportion of 0.01 to 5% by weight (based on epoxy resin), and ���- conventional additives if required. � These reactive resin mixtures are cured by UV radiation and heat. |
申请公布号 |
KR100189642(B1) |
申请公布日期 |
1999.06.01 |
申请号 |
KR19910025362 |
申请日期 |
1991.12.30 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHOEN, LOTHAR;STAPP, BERNHARD;BAYER, HEINER/DE;MARKERT, HELMUT;MUHRER, VOLKER |
分类号 |
B05D3/02;B05D3/06;B05D7/24;C08G59/00;C08G59/68;C08L63/00;C09D163/00;C09J163/00;G03F7/029;H01L21/56;H01L23/29;H05K3/28;(IPC1-7):C09D163/00 |
主分类号 |
B05D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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