发明名称 Metal foil with improved bonding to substrates and method for making the foil
摘要 In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.
申请公布号 US5908542(A) 申请公布日期 1999.06.01
申请号 US19970887393 申请日期 1997.07.02
申请人 GOULD ELECTRONICS INC. 发明人 LEE, CHIN-HO;HAINES, RONALD K.;CZAPOR, EDWARD
分类号 C25D5/14;C25D5/16;C25D5/18;C25D7/06;(IPC1-7):C25D7/06;C23C28/00;C25D5/12 主分类号 C25D5/14
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