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发明名称
CLEANING APPARATUS FOR MOLDING DIE
摘要
申请公布号
KR200141830(Y1)
申请公布日期
1999.06.01
申请号
KR19950021656U
申请日期
1995.08.22
申请人
HYUNDAI ELECTRONICS IND. CO.,LTD
发明人
LEE, JE-SEUNG
分类号
H01L23/28;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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