| 摘要 |
An external interconnection unit including a pad provided on a semiconductor chip, a bump electrode formed on a main surface of a semiconductor chip for connection with the board, and a connection interconnection for connecting the pad and the bump electrode is provided in a plurality of stages in two rows in parallel. The bump electrode is provided on a region other than the region of a sense amplifier region (SR). A semiconductor package having reliability as a semiconductor device prevented from being degraded, and a semiconductor package effectively taking advantage of the feature of a CSP structure is provided. |
