| 摘要 |
<p>A method for perforating heat-sensitive stencil sheet is provided, which comprises ejecting a photothermal conversion material contained in a liquid from a liquid-ejecting means to transfer it together with the liquid to heat-sensitive stencil sheet, and then exposing the heat-sensitive stencil sheet to a visible or infrared ray to perforate the heat-sensitive stencil sheet specifically at portions to which the photothermal conversion material has been transferred. The stencil sheet may have a liquid absorbing layer and a layer reflecting the visible or infrared ray. Upon perforation, stencil sheet is not required to contact any substance such as an original or a thermal head.</p> |
