| 摘要 |
PCT No. PCT/JP97/00257 Sec. 371 Date Dec. 9, 1997 Sec. 102(e) Date Dec. 9, 1997 PCT Filed Feb. 3, 1997 PCT Pub. No. WO98/33959 PCT Pub. Date Aug. 6, 1998This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.
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