发明名称 CIRCUIT PANEL SOCKET WITH CLOVERLEAF CONTACT
摘要 <p>A single in-line memory module socket employing edge stamped contacts positioned within an insulative housing is disclosed. Each terminal has opposed beams with a loop section intermediate the ends of upwardly extending portions of those beams. Inwardly inclined arms extend downwardly from the top of the opposed beams and the contacts are configured so that majority of the deflection of the beams occurs in these inwardly inclined arms. A central post extends upwardly from the base of the terminals and engages housing ribs located within a central spine located along the bottom of a panel receiving slot in the insulative housing. Cavities intersect the slots receiving the circuit panels and the terminals can be inserted into the respective cavities from the bottom, with the posts extending upwardly from the base securing the terminals by engagement with the central spine. Panel support guides extend upwardly at either end of the housing and ridges on flexible walls in the housing stabilize the modules in the sockets.</p>
申请公布号 KR100190795(B1) 申请公布日期 1999.06.01
申请号 KR19900008082 申请日期 1990.06.01
申请人 AMP INC. 发明人 BILLMAN, TIMOTHY BRIAN;THRUSH, ROGER LEE
分类号 H01R24/00;H01R12/72;H01R13/11;H01R13/115;(IPC1-7):H01R13/11 主分类号 H01R24/00
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