发明名称 Unsealing structure with cut out for shrink film sealed packages
摘要 An unsealing structure for packing films that are difficult to rip to pack merchandise is disclosed, where the films can be easily ripped by stripping a tag label. A tearing line 2 is formed in the surface of the film 1 of the film package by hot shearing. A cutout 3 communicates with the tearing line 2 to assist in unsealing the film package. A tag label 4 is affixed to the film 1 and covers the tearing line 2 and the cutout 3.
申请公布号 US5908246(A) 申请公布日期 1999.06.01
申请号 US19970923912 申请日期 1997.09.05
申请人 KOMATSU ELECTRONIC METALS CO., LTD. 发明人 ARIMURA, YOSHIHARU;SAKURAI, YOUICHI
分类号 B65D75/64;B65D65/26;B65D75/58;G09F3/03;(IPC1-7):B65D65/26 主分类号 B65D75/64
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