发明名称 |
Unsealing structure with cut out for shrink film sealed packages |
摘要 |
An unsealing structure for packing films that are difficult to rip to pack merchandise is disclosed, where the films can be easily ripped by stripping a tag label. A tearing line 2 is formed in the surface of the film 1 of the film package by hot shearing. A cutout 3 communicates with the tearing line 2 to assist in unsealing the film package. A tag label 4 is affixed to the film 1 and covers the tearing line 2 and the cutout 3.
|
申请公布号 |
US5908246(A) |
申请公布日期 |
1999.06.01 |
申请号 |
US19970923912 |
申请日期 |
1997.09.05 |
申请人 |
KOMATSU ELECTRONIC METALS CO., LTD. |
发明人 |
ARIMURA, YOSHIHARU;SAKURAI, YOUICHI |
分类号 |
B65D75/64;B65D65/26;B65D75/58;G09F3/03;(IPC1-7):B65D65/26 |
主分类号 |
B65D75/64 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|