| 摘要 |
A structure for mounting a heat sink (50) onto an integrated circuit package (20) mounted on a printed circuit board (10) is constructed such that a guide member (30) having a frame portion (30A) and support post portions (30B) is fixed to the printed circuit board (10), and the heat sink (50) is seated on an inner periphery of the guide member (30) such that the heat sink may be closely contacted with the integrated circuit package (20), and then a cover (60) is fixed to the guide member (30) such that it covers over outer peripheral edge portions of an upper face of the heat sinks (50). This structure is high in cooling efficiency and is easy to mount. <IMAGE> |
