摘要 |
The device is designed for coplanar soldering of laser structures, especially for soldering semi-conducting laser resonators to heat radiators. The device eliminates structure shifts and thermal deformation during the assembly of laser structures. Unique characteristics: The laser structure (3), placed at the edge of the radiator (2), is located between the radiator and the weight (4), in the slideways of the rectangular trough (1). The latter is positioned at an acute angle with respect to the horizontal plane, so that the components of gravitational forces of the radiator (2) and of the weight (2), which presses the structure (3) to the radiator, stabilise the arrangement of these elements during the soldering process.
|