发明名称 Device for coplanar soldering of laser structures, especially for soldering semi-conducting laser resonators to heat radiators.
摘要 The device is designed for coplanar soldering of laser structures, especially for soldering semi-conducting laser resonators to heat radiators. The device eliminates structure shifts and thermal deformation during the assembly of laser structures. Unique characteristics: The laser structure (3), placed at the edge of the radiator (2), is located between the radiator and the weight (4), in the slideways of the rectangular trough (1). The latter is positioned at an acute angle with respect to the horizontal plane, so that the components of gravitational forces of the radiator (2) and of the weight (2), which presses the structure (3) to the radiator, stabilise the arrangement of these elements during the soldering process.
申请公布号 PL176429(B1) 申请公布日期 1999.05.31
申请号 PL19950311856 申请日期 1995.12.15
申请人 INSTYTUT TECHNOLOGII ELEKTRONOWEJ 发明人 WOJCIK IRENEUSZ
分类号 H01L33/00 主分类号 H01L33/00
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