Microwave curable adhesive

摘要

The present invention provides a microwave curable adhesive comprising a polymer composition (e.g., a thermoplastic or thermoset polymer) and first and second microwave susceptible components. The first and second microwave susceptible components have a respective preselected size, preselected shape or preselected conductivity or combination thereof. These properties are selected to provide a multi-modal distribution of first and second microwave susceptible components and to increase microwave adsorption within said polymer composition.