| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer interconnection substrate, wherein deformation of an adhesive sheet is prevented and the shape of a hole formed on the adhesive sheet is stabilized. SOLUTION: A plurality of double-sided circuit substrate 1 wherein a wiring conductor 3 is provided on both sides of an insulating layer 2 are laminated for integration with an adhesive sheet 9 in between, and related to the adhesive sheet 9, a hole is opened at a specified position at a part of two double-sided circuit substrates 1, which sandwich it, contacting the wiring conductor 3, with the hole part provided with a solder conductor 6, and the wiring conductor 3 of the two double-sided circuit substrates 1 is electrically connected with the solder conductor 6. The adhesive sheet 9 comprises a structure where an adhesive agent layer 8 is provided on both surface of a thermo-resistant film 7. |
