| 摘要 |
PROBLEM TO BE SOLVED: To prevent quality deterioration and decrease in yield due to cracking without using tie pad, by adhering a thin transparent board having an adhesive coated to a semiconductor chip arranged portion of a lead frame, adhering a semiconductor chip on the thin transparent board, and then performing a wire bonding. SOLUTION: After installing a thin, transparent board 3, a semiconductor chip 4 is placed on a thin, transparent board 3, and is fixed by an adhesive 6 decomposing by UV radiation 9. Thereafter, wire bonding is performed between a semiconductor chip 4 and a lead frame 1. Diameter of a bonding wire should be 25 to 30μm. Next, UV is radiated to the backside of the semiconductor chip 4, and a thin, transparent board temporarily adhered is removed. By ding this, a mold resin having good adhesion and the bonding of a semiconductor chip can be realized, by which the occurrence of a package cracking can be suppressed and a semiconductor device having a high reliability can be produced. Also, a die touch process can be reduced, which is advantageous for saving cost and time.
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