POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enable fast drying by discharging cleaning liquid used in cleaning a metal base from a drain hole, after cleaning off solder flux for removing solder flux which is generated, when a power semiconductor chip is fixed. SOLUTION: This device is constituted of a metal base 4, a power semiconductor chip 6 mounted on the metal base 4, an input/output terminal 8 soldered to the power semiconductor chip 6 and a case 3, which is molded after the input/output terminal 8 has been, embedded and is bonded by an adhesive to the metal base 4. At least one drain hole 1 or 2 is provided to the metal base 4.