| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module which can connect semiconductor chips to interposers and the interposers to each other at the same time, without requiring the formation of bumps on the front and rear surfaces of the interposers. SOLUTION: This substrates 2a-2c are laminated upon another so that anisotropic conductive rubber bodies 8a and 8b are pinched between through- electrodes 7a and 7b which are connected electrically to each other, and the electrodes 7a and 7b are electrically connected to each other by pressurizing the rubber bodies 8a and 8b by pressing the substrates 2a and 2b against each other. At the same time, semiconductor chips 1a and 1b and bump electrodes 4a and 4b are respectively pinched among the substrates 2a-2c, so that the electrodes 4a and 4b are connected to electric wires 6a and 6c.
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