| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heat treatment device which holds the substrates of plural sizes and can carry out heat treatment. SOLUTION: Supporting pins 10a and 10b supporting the end parts of a substrate W1 having the diameter of 2000 mm and a substrate W2 having the diameter of 300 mm are erected on a supporting arm 15, so that they pass through a heating plate 11. A supporting pin 10b is fitted to a state where a supporting member 13b is locked to a relatively high position detached from the upper end of a pole 14b. The supporting pin 10b is fitted to a relative low state where the supporting member 13b is brought into contact with the upper end of the pole 14b. The substrate W1, or W2 can be transferred with a transportation arm entered from outside by raising/lowering the supporting arm 15.</p> |
