发明名称 SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING DEVICE AND ALIGNER USING THE DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate with a holding force which does not generate dislocation and restrain deformation of a substrate by intaking air inside an air hole connected to an opening part provided to a holding part which holds a substrate and sucking a board to a holding part by applying a negative pressure to a board, and controlling a negative pressure. SOLUTION: When a substrate 1 is mounted on an upper surface of a holder 2, a switching valve of a switching device 6 is set to joint a tube 9a and a tube 9c and a suction device 7 starts suction by maximum suction force of its own. Then, air inside a piping 15 is discharged rapidly, a negative pressure is applied to the board 1 through all the suction ports 4 and the substrate 1 is sucked and held to a surface of the holder 2. A vacuum pressure inside the piping 15 is kept almost constant by a pressure valve 3 and a negative pressure applied to the substrate 1 through the suction port 4 of the holder 2 is also kept almost constant. Thereby, the substrate 1 sucked and held on the holder 2 is not dislocated and deformation of a substrate can be restrained.</p>
申请公布号 JPH11145262(A) 申请公布日期 1999.05.28
申请号 JP19970304340 申请日期 1997.11.06
申请人 NIKON CORP 发明人 KAWAMURA HIDEJI;NARAKI TAKESHI
分类号 G03F7/20;B23Q3/08;H01L21/027;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 G03F7/20
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