| 摘要 |
PROBLEM TO BE SOLVED: To reduce an area of a sealing package by forming an island part, where the whole part is worked in a spiral shape or a meandering shape. SOLUTION: In a lead frame 2, e.g. a mount-island part itself of a semiconductor element is worked into a spiral shape. In the periphery of the spiral-shaped mount-island part 1, a plurality of inner lead parts 3 are arranged which are to be arranged in a package, after a semiconductor integrated circuit device has been completed. When the semiconductor integrated circuit is manufactured by using the lead frame 2, the spiral-shaped mount-island part 1 functions as an inductor by cutting individually the lead frame 2 from a lead frame retaining part. That is, both the mounting function and inductor function can be realized by using only the mount-island part. As result, the miniaturization of the lead frame and the miniaturization of a sealing package as well can be achieved. |
