| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for fitting a substrate to a fitting member, having a simple structure by which the substrate can be surely fixed to the fitting member, it can be made thin and the flux of solder is prevented from sneaking on the substrate. SOLUTION: A flexible substrate 40 in which a desired pattern is formed is placed on a thin fitting plate (fitting member) 20, and a resin frame member 60 is formed by molding in a section surrounding the periphery of the fitting plate 20 and the flexible substrate 40, thereby fixing both the fitting plate 20 and the flexible substrate 40. Therefore the substrate can be surely fixed to the fitting plate 20, and it can be easily made thin, and then a flux can be surely prevented from infiltrating to the substrate by providing the frame member to such a section with a possibility that the flux of solder sneaks on the substrate. |
