| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the mounting structure of a semiconductor device, in which resin for strongly bonding a semiconductor device with a wiring substrate can be easily and surely injected and packed in a void formed between the wiring substrate and the semiconductor device, without significantly scaling the wiring substrate on which the semiconductor device is loaded in the mounting structure for mounting the semiconductor device on the wiring substrate. SOLUTION: A semiconductor device 15, having an electrode pad on the lower face is loaded on a wiring substrate 11 with an insulating substrate 12 which has a semiconductor device loading part on the upper face, a wiring conductor 13 formed in the insulating substrate 12, and a connecting pad 14 formed at the loading part by connecting the connecting pad 14 with the electrode pad by a conductive connecting member 16. Also, resin 17 is packed in a void between the semiconductor device 15 and the loading part, and a connecting hole 18 having an opening in a region immediately under the semiconductor device 15 and the peripheral neighboring region on the upper face of the insulating substrate 12. In this mounting structure of semiconductor device, the resin 17 can be easily injected and packed from the connecting hole 18, after the semiconductor device 15 has been loaded.</p> |
