AUTOMATICALLY STICKING EQUIPMENT OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To enable simply and easily changing a tape roll of an adhesive tape, a residual tape recovering roll, etc., and maintenance in a tape sticking part, in an automatically sticking equipment of a semiconductor wafer. SOLUTION: In an automatically sticking equipment of a semiconductor wafer, an adhesive tape T drawn out from a tape roll is stuck on the lower surface of a ring frame F supplied to a tape sticking position. The stuck adhesive tape T is clipped and cut along the ring frame F, and the ring frame F on which the adhesive tape T is stuck is transferred to a wafer sticking position. A semiconductor wafer W is stuck on the adhesive tape of the ring frame F. A drawer unit U in which a tape roll and a residual tape recovering roll are installed is arranged below a tape sticking position, and the drawer unit U is so constituted that pulling-out and pushing-in-loading from the front of the equipment are enabled.