| 摘要 |
PROBLEM TO BE SOLVED: To mount chip-like optical devices on a substrate with their patterns arranged at specified positions, by repeating a step of provisionally fixing the devices to specified positions of an aligning jig through adhesives, and pressing the fixed chips to the substrate through molten solder, together with the jig. SOLUTION: A manufacturing method comprises the steps of aligning a surface pattern 11 of chip-like components, with corresponding markers 21 of an aligning jig 12 to align a chip-like optical device 1 with the jig 12, provisionally fixing the device 1 to the jig 12, similarly provisionally fixing other chips 2, 3 to the jig 12, heating a substrate 16 over the solder m.p. by a substrate heater 29, aligning the substrate 16 with the jig with the chips 1, 2, 3 fixed thereto, and pressing the chips 1, 2, 3 to the substrate 16 via solder 20, together with the jig 12. |
