| 摘要 |
PROBLEM TO BE SOLVED: To connect between electrode portions or connecting terminal portions of an electronic part such as highly integrated IC efficiently, accurately and stably, by providing a bump structure made with a hollow body for electrically connecting a first member to a second member. SOLUTION: In a configuration of an embodiment of a bump structural body 1, a first member 2 is electrically connected to a second member 3. This bump structure 1 is constituted with an hollow body 4. Also, the bump structure 1 is desired to have at least one point-shaped contact portion 5. Also, the bump structure 1 should have a bump structure forming member having a shape such as polygonal pyramid including a pyramid, quadrangular pyramid, circular cone or semi-sphere, or a shape of a combination of at least two-bump structures having any of these shapes. |
