METHOD OF MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component capable of mounting the electronic component requiring high precision mounting on the printed circuit board in any case of deteriorated detective precision of a detective means of absorption position caused by various conditions. SOLUTION: After an electronic component is absorbed by an absorption section, an angle of the electronic component and a shift of position in X and Y direction from the center of the absorption section at absorption is measured (Step 1). A rotation direction is controlled to rotate the electronic component absorbed to a mounting angle (Step 2). A position of the electronic component compensated by rotation is again measured to confirm the electronic component is compensated by rotation to the predetermined mounting angle and to measure a shift of position in X and Y directions from the center of the absorption section (Step 3). The shift of position in the rotation direction is again compensated and the shift of position in X and Y directions from the center of the absorption section is compensated to mount the electronic component to the predetermined mounting position (Step 4).