| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to reliably contact a conducting ball to an electrode pad of an electronic part, by forming a through-hole using a template in which the side wall of the through-hole is smoothened, and by positioning a conductive ball for creating a bump to an electrode by means of the through- hole in the template. SOLUTION: A template 20 for loading a conductive ball (metal ball) has a through-hole 26. The through-holes 26 are arranged in the same arrangement as that of electrodes for an electronic part. Also, a metal ball loading template 20 is made of glass as an inorganic material. This glass plate is formed to a through-hole by etching. In this case, if a through-hole 26 is made by etching a glass plate, the side wall of the through-hole 26 cannot be finished smoothly and burs 42 are created. Therefore, a laser beam LB is radiated to the side wall of the through-hole 26 for smoothening its side wall. Also, a mask 44 is applied and the laser beam LB is radiated. By doing this, a metal ball loading template 20 having a through-hole 26 with smooth surface can be obtained. |
