| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method and a metallic mold for improving the reliability of a product by suppressing gate jammings due to particles of resin whose fusion is insufficient, improving yield, and stabilizing the variations of sealing due to the gate jammings at the time of sealing plural cavities with one pot, in a method for sealing a semiconductor device by using granular resin. SOLUTION: Granular resin emitted from a pot 3 is allowed to pass through one restriction 9 and distributed to each cavity 5. Also, the granular resin ejected from the pot 3 is distributed from the pot 3 to plural restriction 9, temporarily merged in one runner 4 or a resin bank 8, and then distributed to each cavity 5 again. Thus, the particles of the resin the fusion of which is insufficient can be completely fused, and a gate 7 can be prevented from being jammed. Therefore, stable sealing can be attained. |
