| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing it, for bonding an electrode pad on a semiconductor chip with a thin wire lead frame in a multilayered constitution with high reliability by easing thermal and mechanical shock. SOLUTION: A metal bump 5 made of a first kind of metal M1 is formed on an electrode pad 3 of a semiconductor chip 2, and a lower layer 7a of a lead frame 6 having a fine wire lead 7 in a three layer structure consisting of the lower layer 7a made of a second kind of metal M2, an intermediate layer 7b, and an upper layer 7c is connected with this metal bump 5. |
