| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer aligning apparatus which can be made compact in its structure and can shorten a wafer transfer time. SOLUTION: This wafer aligning apparatus includes a table 40 for carrying thereon a carrier accommodating a plurality of wafers aligned in parallel, first support mechanisms 42 and 43 relatively moved up toward the table 40 for supporting the wafers within the carrier, and a second support mechanism 60 for supporting odd-numbered or even-numbered ones of the wafers supported by the first support mechanisms 42 and 43 and for relatively moving up the supported wafers toward the other wafers. One of the first and second support mechanisms 42, 43 and 60 is arranged to be freely pivotable with respect to the other. Thereby a prior art structure including a carrier base, loader mechanisms and the array space of an aligning part can be made compact, and correspondingly a wafer transfer time can be shortened. |
