| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a tape for TAB in which the thickness of polyimide based solder resist can be made simply at least 10μm or more, and yield and productivity of a tape for tape automated bonding(TAB) are improved. SOLUTION: A copper foil wiring pattern 1 is formed on one side surface of a polyimide film 13, and an adhesive agentless single-sided copper covering CCL 3 is formed. The copper foil wiring pattern 1 side and a polyimide based solder resist 4 side of the adhesive agentless single-sided surface copper covering CCL 3 are stuck together (201, 202), and a photocover lay 12 is patterned through exposure and development (203). After the polyimide based solder resist 4 has been etched with alkaline solution (NaOH) of 10% by using the patterned photocover lay 12 as a mask, curing for polyimide 2 is performed by baking treatment (204). After that, the photocover lay 12 is peeled off, and a tape 6 for TAB is manufactured (205).
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