| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability, by providing a columnar electrode formed on an electrode of a wiring circuit board and an element mounted by face-down bonding through connections on this columnar electrode, thereby forming a sufficient gap between a pattern formed on the element and the wiring circuit board. SOLUTION: A dry film resist 10 is laminated on the side of an element mounting surface of a wiring circuit board 1. As a plating resist, a resist 12 for a columnar electrode is formed, and a columnar electrode 6 is formed at an opening of the resist 12. The resist 12 for columnar electrode which became unnecessary is swelled and peeled off, and a wiring circuit board 1 having a columnar electrode 6 to be used as a connecting portion during element mounting is obtained. On a pad 4 on an element 3, a bump 5 is provided, the side of a forming surface for the bump 5 faces the wiring circuit board, and the columnar electrode 6 and the bump 5 are aligned each other. The bump 5 is melted by reflow or the like, the columnar electrode 6 and a pad 4 on the element 3 are electrically connected, and then the mounting of the element 3 on the wiring circuit board 1 is completed. |
