发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photoresist excellent in various properties such as resolving power, sensitivity, heat resistance, focus margin, exposure margin, adhesion, foaming margin, shelf stability and appliability and useful for microfabrication. SOLUTION: In a photosensitive resin compsn. contg. an alkali-soluble resin, a photosensitive compd. and a solvent, novolak resin made of a polycondensation product of a phenolic compd. and 1,3,5-trioxane is used as the alkali-soluble resin.
申请公布号 JPH11143077(A) 申请公布日期 1999.05.28
申请号 JP19970301912 申请日期 1997.11.04
申请人 MITSUBISHI CHEMICAL CORP 发明人 NAKANO KOJI;TAKADA YOSHIHIRO;OOHATA TATSUHIRO
分类号 G03F7/004;G03F7/023;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/004
代理机构 代理人
主权项
地址