JACK MODULE

摘要

A digital signal cross-connect module has a dielectric faceplate with a plurality of ports. The plurality of ports includes at least two linear arrays of ports each including a monitor jack port and two access ports. The arrays are positioned vertically and parallel to one another. The ports are divided into three transverse fields. All monitor ports are positioned in a first transverse field. The access ports are positioned in second and third transverse fields with the second and third transverse fields vertically offset from each other to increase a horizontal density of ports within the module.