| 摘要 |
<p>A laminate comprising a plurality of laminate units each comprising a thin resin layer and a thin metal layer wherein the surface roughness of the thin resin layer is 0.1νm or below, a protrusion forming component is not added to the thin resin layer or the surface roughness of the thin metal layer is 0.1νm or below. The surface characteristics are improved regardless of the thickness of the laminate and the requirement of high performance thin film can be satisfied because the laminate contains no foreign matter. The laminate is suitably applicable to electronic parts, e.g., a capacitor, especially a chip capacitor.</p> |
