| 摘要 |
<p>A method for transfer molding a standard electronic package and an apparatus resulting from such method. A substrate (10) with an attached electronic device (20) is placed in lower platen (23), with end (54) of spacer (53) contacting inside surface (79) and end (55) contacting inside surface (81). A molding compound passes into mold cavity (25) through runner (24), into gate (26 and 27) and flows over upper surface (57) and lower surface (59) and around edges (8) of substrate (10). A seal is formed from portions (77 and 83) of the mold platens (23, 29) and a portion of a printed circuit board (10) along at least one side of the printed circuit board (10), adjacent to electrical contacts (51) located within protective cavity (95). After the apparatus is removed from the mold, steps (91 and 93) create an attachment area for a protective cap which is placed over the electrical contacts (51).</p> |
