发明名称 MEMBRANE PARTITION SYSTEM FOR PLATING OF WAFERS
摘要 <p>An anode includes an anode cup (202), a membrane (208) and ion source material (206), the anode cup (202) and membrane (208) forming an enclosure in which the ion source material (206) is located. The anode cup (202) includes a base section (216) having a central aperture (214) and the membrane (208) also has a central aperture (207). A jet (200) is passed through the central aperture (214) of the base section (216) of the anode cup (202) and through the membrane (208) allowing plating solution to be directed at the center of a wafer being electroplated.</p>
申请公布号 WO1999025902(A1) 申请公布日期 1999.05.27
申请号 US1998022826 申请日期 1998.10.26
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