Electrical interconnect system

摘要

An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer (56); at least one protrusion (118) on the flexible first layer (56) that has an electrical contact (100); a second layer (54) having at least one electrical contact (134); and a spring device (124) coupled to the flexible first layer (56) and to the second layer (54) for pressing the electrical contact (100) on a protrusion (118) on the flexible first layer (56) to the electrical contact (134) on the second layer (54) to electrically connect the electrical contact (100) on the protrusion (118) to the electrical contact (134) on the second layer (54). In a specific embodiment the spring device (124) for pressing the electrical contact (100) on the protrusion (118) of the flexible first layer (56) to the electrical contact (134) on the second layer (54) includes relief device (132) for allowing the flexible first layer (56) to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts (100) on the protrusions (118) on the flexible first layer (56) and the corresponding electrical contacts (134) on the second layer (54) are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer (56) and the second layer (54) and the spring device (124) for aligning the flexible first layer (56) with the second layer (54) and the spring device (124). The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.