RESIN COMPOSITION FOR COPPER-CLAD LAMINATE, COPPER FOIL WITH RESIN, MULTILAYER COPPER-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain the subject composition having a small coefficient of thermal expansion, having high heat resistance, manifesting a high crack resistance even after receiving a heat shock or the like by including a specific compounding material, a maleimide compound and a specified polymer. SOLUTION: The objective composition comprises (A) an epoxy resin compounding material comprising (i) an epoxy resin (e.g. a bisphenol A type epoxy resin), (ii) a hardener of the component (i) (e.g. a dicyandiamide) and if necessary (iii) a hardening accelerator (e.g. imidazoles), (B) a maleimide compound [e.g. bis(3-ethyl-5-methyl-4-maleimidephenyl)methane] and (C) an aromatic polymer such as a polyethersulfone resin, an aromatic polyamide resin and a polyamideimide resin, having a functional group polymerizable with the component (i) or the component B and soluble in a solvent. The mixing ratio is preferably 40-80 pts.wt. component A, 10-50 pts.wt. component B and 5-30 pts.wt. component C based on 100 pts.wt. whole weight of the composition.