Process for manufacturing a flip-chip integrated circuit

摘要

A method of producing a packaged semiconductor integrated circuit including hardened resin packaging and a polished electrode including producing external electrodes on a wafer including an IC chip employing photolithography in a process for producing an IC chip; depositing and hardening resin on the wafer; polishing the wafer to clean the external electrodes; and cutting the wafer and separating the resulting chips from the wafer, thereby producing a flip-chip package.