发明名称 HIGHLY VIBRATION-DAMPING MOLDED FORM FOR OA EQUIPMENT PART
摘要 PROBLEM TO BE SOLVED: To obtain the subject molded form by using a polyphenylene ether- based resin with excellent mechanical strengths, heat resistance and dimensional accuracy without impairing the characteristics inherent in the resin. SOLUTION: This molded form is obtained using a polyphenylene ether-based resin composition comprising a resin component with the following formulation: 100 pts.wt. of the resin component is composed of (1) 50-100 pts.wt. of a polyphenylene ether-based resin consisting of 10-100 wt.% of a polyphenylene ether and 0-90 wt.% of a styrene-based resin, and (2) 0-50 pts.wt. of a thermoplastic elastomer. The above resin composition has the following properties: flexural modulus at 23 deg.C determined in accordance with the ASTM D790 is >=1,500 MPa, damping ratio at 23 deg.C is >=1.0, heat distortion temperature determined by the ASTM D648 is >=80 deg.C, and the product of the flexural modulus and the damping ratio is >=10,000 MPa.
申请公布号 JPH11140298(A) 申请公布日期 1999.05.25
申请号 JP19970325153 申请日期 1997.11.12
申请人 MITSUBISHI ENG PLAST CORP 发明人 KURASAWA YOSHIHIRO;KOKUBO AKIHIRO;NISHIDA KOJI
分类号 C08L71/12;(IPC1-7):C08L71/12 主分类号 C08L71/12
代理机构 代理人
主权项
地址