| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition having improved productivity, heat resistance, weathering resistance, transparency, and adhesion to semiconductor elements by including bisphenol A and/or alicyclic vinyl ester resins, a (meth)acrylic ester monomer, a mercapto-containing compound, and an organic peroxide. SOLUTION: Bisphenol A and/or alicyclic vinyl ester resins obtained by reacting bisphenol A and/or alicyclic hydroxyl-terminated compounds with (meth)acrylic acid is mixed with 0-40 wt.%, desirably, 5-30 wt.% (meth)acrylic ester monomer, 0.5-15 wt.%, desirably 3-10 wt.% mercapto-containing compound and 0.5-4 wt.% organic peroxide to obtain a transparent sealing resin composition having a viscosity (at ordinary temperature) of 50 P or below, desirably, 20 P or below, and giving a transparent cured product having a glass transition temperature of 90 deg.C or above when cured by heating at 100-150 deg.C for 0.2-2 hr. |
