| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP polishing pad which is not affected by dissolution and corrosion due to polishing agent. SOLUTION: A CMP polishing pad 10 mainly contains A and B components, including bisphenol A epoxy resin, novolak epoxy resin, bisphenol F epoxy resin, or these polymer and these deformed epoxy resin, aromatic amines, aromatic acid anhydride, imidazols, or these polymer and these deformed hardening agent, the surface hardness being 2.5-40 at a Vickers hardness. |
