| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device, capable of polishing a semiconductor wafer with the polished face to be uniformed in plane. SOLUTION: A polishing device 1A has a polishing head 50 provided with a suction means including a suction groove 51 and a through-hole 61 for polishing the polished surface Sa of a thin polished material S held by a rotary polishing head 50 by using a polishing pad 3 mounted on the surface of a fixed polishing rotary plate 2, and an elastic holding film 80 provided with plural through-holes 81 and mounted on the held face of the polished material S on the polishing head 50, so that the polished material S can be attracted to and held on the polishing head 50 via the holding film 80 with vacuum suction force for polishing. |
