| 摘要 |
<p>The present invention relates to chucks and methods for positioning multiple objects, optionally for transport onto a recipient substrate. Instead of using conventional clamps that employ mechanical force, the present invention is directed to the use of a non-mechanical force such as negative pressure in a vacuum chuck, or static electricity in an electrostatic chuck as the force applied to the objects held by the chuck. Further, the chuck has a layer for holding the objects which are optionally subsequently transferred to a recipient substrate, the layer having a configuration substantially corresponding to the configuration of the recipient substrate. In certain aspects, the present invention is directed to a chuck for positioning objects with an average width or diameter less than or equal to one millimeter, and a thickness preferably less than about 3 millimeters, such as beads used in the chemical industry. In another aspect, the invention is directed to methods which involve the use of chucks, including methods for attracting an object or multiple objects, methods for positioning objects, methods for transporting objects, preferably substantially simultaneously, and methods of chemical manufacturing using the chucks.</p> |
