| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of idle rotation of a wafer in a device which polishes both surface of the wafer through planetary movement between of a circular carrier which holds the wafer thereinside, between upper and lower surface plates, by forming a projection, on an inner peripheral surface of the carrier, to be fitted to a cutout on an outer peripheral surface of the wafer. SOLUTION: A carrier 3 adopted to a wafer polishing device is a disc-like planetary gear having, on its outer periphery, teeth 3a to be meshed with a sun gear and an inner gear. A hole 7 is eccentrically formed on the carrier 3, to which hole 7 a wafer 10 extracted from a silicon single crystal rod in fit. A V-notch (cutout) 11 is formed on an outer periphery of the wafer 10 for indicating crystal orientation. A V-shaped projection 3b to which the cutout 11 of the wafer 10 is fitted is formed on an inner peripheral surface of the carrier 3, at its portion faced to the hole 7. It is thus possible to prevent idle rotation of the wafer 10 held in the hole 7, and prevent abrasion of a peripheral part caused by the idle rotation phenomenon of the wafer 10. |
