发明名称 |
A heat sink |
摘要 |
<p>A heat sink comprising: a body having an envelope including a flexible portion for thermal contact with a heat source, the envelope being filled with a thermally conductive liquid; and a thermosyphon having one end disposed at least partly within the liquid in the body to absorb heat from the heat source and another end disposed outside the envelope to dissipate heat.</p> |
申请公布号 |
SG64996(A1) |
申请公布日期 |
1999.05.25 |
申请号 |
SG19970002399 |
申请日期 |
1997.07.08 |
申请人 |
DSO NATIONAL LABORATARIES |
发明人 |
KONG CHANG WENG;WAH WONG YEW;YU LIU CHANG;FAH CHOO KOK;WOON TOU KWOK |
分类号 |
F28D15/00;F28D15/02;F28F1/32;H01L23/427;(IPC1-7):H05K7/20 |
主分类号 |
F28D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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