| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which has a good moldability and gives a cured item excellent in flame retardancy, reflow crack resistance, and dielectric properties by compounding a specific epoxy resin with a phenol resin and an inorg. filler. SOLUTION: An epoxy resin of formula I (wherein R<1> is H, 1-4C alkyl, or phenyl; (p) is 1-4, pref, 1-2; and (n) is 0-10, pref. 0-3, still pref. 0-2) having melt viscosity [measured with an ICI viscometer (a cone and plate type) at 150 deg.C] of 0.1-2.5 P, pref. 0.1-0.8P, is compounded with a phenol resin of formula II (wherein R<2> is H, 1-4C alkyl, or phenyl; (q) is 1-4, pref. 1-2; and (m) is 0-10, pref. 0-3, still pref. 0-2) having a melt viscosity [measured with an ICI viscometer (a cone and plate type) at 150 deg.C] of 0.1-1.2 P, an inorg. filler having an average particle size of 5-30μm, and optionally additives such as a stress- reducing agent, a wax, a colorat, and a halogen scavenger. |
