| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device, capable of making itself smaller and partially controlling a polishing amount. SOLUTION: A polishing device has a rotary placement 14 rotated while holding a polished material W, a rotary polishing plate 28 made smaller in diameter than the rotary placement and provided with a polishing layer 30 on the surface, a scanning mechanism 26 to relatively move the rotary polishing plate to the radial direction of the rotary placement while putting the polishing layer 30 in press contact with the polished material W and a polishing liquid supply means 46 to supply polishing agent to the surface of the polished material W. In this way, the smaller device is achieved and a polishing amount is partially controlled. |
