| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition capable of easily giving a molded product with no debonding on its surface when subjected to injection molding, therefore applicable to a wide range of molded forms. SOLUTION: This composition comprises (a) 99-1 wt.% of a polyphenylene ether-based resin, (b) 0.01-20 pts.wt., based on 100 pts.wt. of the component (a), of a modifier simultaneously having double bond and primary amine and/or secondary amine structure (e.g. acrylamide, allylamine), and (c) 99-1 wt.% of a polyolefin-based resin. |
