发明名称 |
Multi-view imaging apparatus |
摘要 |
An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
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申请公布号 |
US5907178(A) |
申请公布日期 |
1999.05.25 |
申请号 |
US19980031028 |
申请日期 |
1998.02.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BAKER, ROBERT GROVER;BERTIN, CLAUDE LOUIS;HOWELL, WAYNE JOHN;MOSLEY, JOSEPH MICHAEL |
分类号 |
H01L27/14;G01J1/02;H01L21/60;H01L23/02;H01L25/065;(IPC1-7):H01L23/02;H01L23/34 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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