发明名称 Aligner and exposure method
摘要 <p>A wafer is put on a wafer stage which is placed on a surface plate transferably in an X-direction and a Y-direction. The pattern image of a reticle is exposed in an exposure region on the wafer and the reticle and the wafer are scanned in the Y-direction to perform exposure. A measurement stage is placed on the surface plate transferably in the X-direction and the Y-direction independently of the wafer stage. A space image detection system which includes a dose monitor, an illuminance unevenness sensor and a measurement plate in which a slit is formed is set up on the measurement stage. As the wafer stage may have only minimum functions necessary for exposure, the size and weight of the wafer stage can be reduced. With this constitution, the size of a stage for the alignment of a reticle or a wafer can be reduced while the function of measuring the state of an exposing light or image forming characteristics is maintained.</p>
申请公布号 AU9648198(A) 申请公布日期 1999.05.24
申请号 AU19980096481 申请日期 1998.10.26
申请人 NIKON CORPORATION 发明人 TETSUO TANIGUCHI
分类号 G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
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